HSB12-272706

HSB12-272706

HSB12-272706

  • Available: 583
  • Manufacturer: CUI Devices
  • Part Number: HSB12-272706
  • Detailed Description:Heat Sink BGA Aluminum Alloy 3.8W @ 75°C Top Mount
  • Category:Fans, Thermal Management | Thermal - Heat Sinks
  • RoHS Status: ROHS Compliant
  • Datasheet: Datasheet
Reference Price (USD)
1+
1.0680
10+
1.0039
100+
0.9505
1000+
0.8971
10000+
0.8437

Considering price fluctuations, this price is only for reference. Please send RFQ to info@aceera.net to get the best price, thank you.

Manufacturer CUI Devices
Series HSB
Package Box
Standard Package 1540
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.236" (6.00mm)
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow 7.80°C/W @ 200 LFM
Thermal Resistance @ Natural 19.59°C/W
Material Aluminum Alloy
Material Finish Black Anodized
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100

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