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Manufacturer | CUI Devices |
---|---|
Series | HSB |
Package | Box |
Standard Package | 3872 |
Product Status | Active |
Type | Top Mount |
Package Cooled | BGA |
Attachment Method | Adhesive |
Shape | Square, Pin Fins |
Length | 0.669" (17.00mm) |
Width | 0.669" (17.00mm) |
Diameter | - |
Fin Height | 0.236" (6.00mm) |
Power Dissipation @ Temperature Rise | 2.5W @ 75°C |
Thermal Resistance @ Forced Air Flow | 13.10°C/W @ 200 LFM |
Thermal Resistance @ Natural | 29.73°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
RoHS Status | ROHS3 Compliant |
---|---|
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8473.30.5100 |