HSB04-171706

HSB04-171706

HSB04-171706

  • Available: 2500
  • Manufacturer: CUI Devices
  • Part Number: HSB04-171706
  • Detailed Description:Heat Sink BGA Aluminum Alloy 2.5W @ 75°C Top Mount
  • Category:Fans, Thermal Management | Thermal - Heat Sinks
  • RoHS Status: ROHS Compliant
  • Datasheet: Datasheet
Reference Price (USD)
1+
0.9720
10+
0.9137
100+
0.8651
1000+
0.8165
10000+
0.7679

Considering price fluctuations, this price is only for reference. Please send RFQ to info@aceera.net to get the best price, thank you.

Manufacturer CUI Devices
Series HSB
Package Box
Standard Package 3872
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 0.669" (17.00mm)
Width 0.669" (17.00mm)
Diameter -
Fin Height 0.236" (6.00mm)
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow 13.10°C/W @ 200 LFM
Thermal Resistance @ Natural 29.73°C/W
Material Aluminum Alloy
Material Finish Black Anodized
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100

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