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Manufacturer | MG Chemicals |
---|---|
Series | 4900 |
Package | Bulk |
Standard Package | 1 |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
Diameter | - |
Melting Point | 423 ~ 430°F (217 ~ 221°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Jar, 8.8 oz (250g) |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 35°F ~ 50°F (2°C ~ 10°C) |
Base Product Number | 4900 |
RoHS Status | ROHS3 Compliant |
---|---|
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.30.3000 |