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| Manufacturer | Yamaichi Electronics |
|---|---|
| Series | IC |
| Package | Tray |
| Standard Package | 1 |
| Product Status | Active |
| Type | QFP |
| Number of Positions or Pins (Grid) | 144 |
| Pitch - Mating | 0.020" (0.50mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.020" (0.50mm) |
| Contact Finish - Post | - |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | - |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | -40°C ~ 170°C |
| Termination Post Length | - |
| Material Flammability Rating | - |
| Contact Resistance | 30mOhm |
| RoHS Status | |
|---|---|
| Moisture Sensitivity Level (MSL) | |
| REACH Status | |
| ECCN | |
| HTSUS |