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Manufacturer | Yamaichi Electronics |
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Series | IC |
Package | Tray |
Standard Package | 1 |
Product Status | Active |
Type | QFP |
Number of Positions or Pins (Grid) | 144 |
Pitch - Mating | 0.020" (0.50mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | - |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.020" (0.50mm) |
Contact Finish - Post | - |
Contact Finish Thickness - Post | - |
Contact Material - Post | - |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature | -40°C ~ 170°C |
Termination Post Length | - |
Material Flammability Rating | - |
Contact Resistance | 30mOhm |
RoHS Status | |
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Moisture Sensitivity Level (MSL) | |
REACH Status | |
ECCN | |
HTSUS |